Sarmah, AnubhavDesai, Suchi K.Crowley, Ava G.Zolton, Gabriel C.Tezel, Güler BengüsuHarkin, Ethan M.2023-08-142023-08-142022Sarmah, A., Desai, S. K., Crowley, A. G., Zolton, G. C., Tezel, G. B., Harkin, E. M., ... & Green, M. J. (2022). Additive manufacturing of nanotube-loaded thermosets via direct ink writing and radio-frequency heating and curing. Carbon, 200, 307-316.0008-62231873-3891http://dx.doi.org/10.1016/j.carbon.2022.08.063https://hdl.handle.net/20.500.12491/11507This study was supported by the Samsun Ondokuz Mayis University Research Fund (Project PYO.DIS.1904.20.008).Direct Ink Writing (DIW) is an extrusion-based additive manufacturing method where the print medium is a liquid-phase 'ink' dispensed out of nozzles and deposited along digitally defined paths. Conventional DIW of thermosetting resins relies on viscosity modifying agents, novel crosslinking chemistries, and/or long curing schedules in an oven. Here we demonstrate the use of a co-planar radio frequency applicator to generate an electric field, which can be used to rapidly heat and cure nano-filled composite resins as they are printed. This method avoids the need for an oven or post-curing step. This process consists of a sequential print-and-cure cycle which allows for printing of high-resolution, multi-layered structures. Every extruded layer is partially cured using RF before depositing the next layer; this allows the printed part to maintain structural integrity. The process enables both increased throughput and decreased touch time relative to traditional manufacturing. Commercial epoxy resin with varied nano-filler loadings were examined as DIW candidates. After printing, the thermo-mechanical properties, surface finish, and shape retention of RF-cured samples were comparable to conventionally cured samples. This method of manufacturing establishes RF heating as a suitable alternative to conventional methods, facilitating rapid, free-form processing of thermosetting resins without a mold.eninfo:eu-repo/semantics/closedAccessDirect Ink WritingRadio Frequency HeatingThermosetting ResinFree-Form Processing3DPolymersMetalsArticle10.1016/j.carbon.2022.08.0632003073162-s2.0-85137045728Q1WOS:000855247100003Q1