Effect of diffusion annealing temperature on crack-initiating omnipresent flaws, void/crack propagation and dislocation movements along ni surface-layered bi-2223 crystal structure

Basit Öğe Kaydı
dc.authorid0000-0002-5177-3703
dc.authorid0000-0003-0304-1097
dc.contributor.authorYıldırım, Gürcan
dc.contributor.authorTurgay, Tahsin
dc.date.accessioned2021-06-23T18:38:35Z
dc.date.available2021-06-23T18:38:35Z
dc.date.issued2018
dc.departmentBAİBÜ, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.description.abstractThis study aims to find out the crucial variations in the mechanical performance and characterization of Bi-2223 superconducting compounds with the diffusion annealing temperatures interval 650 °C-850 °C by means of Vickers hardness measurements exerted at the different applied indentation test loads (0.245 N-2.940 N) and derived theoretical findings. All the experimental results and theoretical evidences showed that the mechanical characterization and performances improve with the increment in the diffusion annealing temperature up to 700 °C due to the development in structural properties. Namely, the optimum annealing temperature of 700 °C resulting in the optimum penetration of Ni impurities into both the superconducting grains and over the grain boundaries develops the crystallinity of Bi-2223 crystal structure. In other words, the surface energy related to the crack-initiating omnipresent flaws, void/crack propagation and dislocation movement reduces due to the augmented critical stress value. In this respect, the diffusion annealing temperature of 700 °C develops the mechanical durability, stiffness, ideal fracture and flexural strength. However, after the certain diffusion annealing temperature value of 700 °C, the crystallinity tends to degrade considerably and in fact dwelling in the worst crystal structure for 850 °C annealing temperature. Accordingly, the initial crack growths, sizes of crack-producing flaws, void/crack propagation and dislocation movement in the copper-oxide consecutively stacked layers reach much more rapidly to the critical speeds due to the increased stress amplification so that the Bi-2223 compound with the augmented brittle behavior breaks at even lower test load. Moreover, it is observed that the presence of optimum nickel impurities in the crystal structure strengthens the standard indentation size effect behavior.en_US
dc.identifier.doi10.16984/saufenbilder.341709
dc.identifier.endpage1220en_US
dc.identifier.issn2147-835X
dc.identifier.issue5en_US
dc.identifier.startpage1211en_US
dc.identifier.trdizinid311866en_US
dc.identifier.urihttps://doi.org/10.16984/saufenbilder.341709
dc.identifier.urihttps://app.trdizin.gov.tr/makale/TXpFeE9EWTJOZz09
dc.identifier.urihttps://hdl.handle.net/20.500.12491/2762
dc.identifier.volume22en_US
dc.indekslendigikaynakTR-Dizinen_US
dc.institutionauthorYıldırım, Gürcan
dc.language.isoenen_US
dc.relation.ispartofSakarya Üniversitesi Fen Bilimleri Enstitüsü Dergisien_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectBi-2223 Crystal Structureen_US
dc.subjectNi Impurity Diffusionen_US
dc.subjectAnnealing Temperatureen_US
dc.subjectCracks/Voidsen_US
dc.subjectDislocationsen_US
dc.titleEffect of diffusion annealing temperature on crack-initiating omnipresent flaws, void/crack propagation and dislocation movements along ni surface-layered bi-2223 crystal structureen_US
dc.typeArticleen_US

Dosyalar

Orijinal paket
Listeleniyor 1 - 1 / 1
Küçük Resim
İsim:
gurcan-yildirim.pdf
Boyut:
497.71 KB
Biçim:
Adobe Portable Document Format
Açıklama:
Tam metin / Full text
İndir

Koleksiyon

TR-Dizin İndeksli Yayınlar Koleksiyonu
Fizik Bölümü Koleksiyonu
Makine Mühendisliği Bölümü Koleksiyonu