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  1. Ana Sayfa
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Yazar "Berlea, Dumitru-Vlad" seçeneğine göre listele

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    MALTA3: Concepts for a new radiation tolerant sensor in the TowerJazz 180 nm technology
    (Elseiver, 2022) Dobrijević, Dominik; Allport, Phil; Asensi, Ignacio; Berlea, Dumitru-Vlad; Bortoletto, Daniela; Denizli, Haluk; Oyulmaz, Kaan Yüksel
    The upgrade of the MALTA DMAPS designed in Tower 180 nm CMOS Imaging process will implement the numerous modifications, as well as front-end changes in order to boost the charge collection efficiency after the targeted fluence of 1x10(15) 1 MeVn(eq)/cm(2). The effectiveness of these changes have been demonstrated in recent measurements with a small-scale Mini-MALTA demonstrator chip. Multiple changes in the digital periphery are proposed: The asynchronous address generator will be revised to provide more control over the pulse length. The Synchronization memory will be upgraded with the goal of achieving a sub-nanosecond timing resolution. Serial chip to chip data transfer will be prototyped, in order to gauge the plausibility of implementation on a future full sized chip. Apart from these changes, research of the overall sensor architecture will be discussed as well.
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    Recent results with radiation-tolerant TowerJazz 180 nm MALTA sensors
    (Elseiver, 2022) LeBlanc, Matt; Allport, Phil; Asensi, Igancio; Berlea, Dumitru-Vlad; Bortoletto, Daniela; Denizli, Haluk; Oyulmaz, Kaan Yüksel
    To achieve the physics goals of future colliders, it is necessary to develop novel, radiation-hard silicon sensors for their tracking detectors. We target the replacement of hybrid pixel detectors with Depleted Monolithic Active Pixel Sensors (DMAPS) that are radiation-hard, monolithic CMOS sensors. We have designed, manufactured and tested the MALTA series of sensors, which are DMAPS in the 180 nm TowerJazz CMOS imaging technology. MALTA have a pixel pitch well below current hybrid pixel detectors, high time resolution (< 2 ns) and excellent charge collection efficiency across pixel geometries. These sensors have a total silicon thickness of between 50-300 mu m, implying reduced material budgets and multiple scattering rates for future detectors which utilise such technology. Furthermore, their monolithic design bypasses the costly stage of bump-bonding in hybrid sensors and can substantially reduce detector costs. This contribution presents the latest results from characterisation studies of the MALTA2 sensors, including results demonstrating the radiation tolerance of these sensors.

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